Brede toepassing van hexagonaal boornitride - chipkoelmateriaal

Naarmate elektronische componenten en systemen kleiner en sneller worden, worden warmtebehandeling en betrouwbaarheid belangrijke kwesties die hun levensduur beïnvloeden. Het thermische beheer van lokale hotspots met een hoge warmtestroom is de sleutel van krachtige elektronische apparaten.

Although graphene has a very high thermal conductivity (5300W/(m·K)), it was found in the experiment that the thickness of the silicon dioxide insulation layer on the chip surface would affect the heat dissipation effect of graphene. If the silicon dioxide layer is too thick, it will hinder the effective conduction of hot spot heat to the graphene layer; if the silicon dioxide layer is too thin, it is easy to make the metal circuit contact with the graphene layer and cause short circuit. Hexagonal boron nitride, as a material of both insulation and high thermal conductivity, will become the key material to improve the heat dissipation capacity of chips.